M24M01-HRMN6TP
vs
W25X20LZPI
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
WINBOND ELECTRONICS CORP
|
| Part Package Code |
SOIC
|
SON
|
| Package Description |
0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8
|
HVSON, SOLCC8,.25
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
3A991.B.1.B.1
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Samacsys Manufacturer |
STMicroelectronics
|
|
| Clock Frequency-Max (fCLK) |
1 MHz
|
33 MHz
|
| Data Retention Time-Min |
40
|
20
|
| Endurance |
1000000 Write/Erase Cycles
|
100000 Write/Erase Cycles
|
| I2C Control Byte |
1010DDMR
|
|
| JESD-30 Code |
R-PDSO-G8
|
R-XDSO-N8
|
| JESD-609 Code |
e4
|
e0
|
| Length |
4.9 mm
|
6 mm
|
| Memory Density |
2097152 bit
|
2097152 bit
|
| Memory IC Type |
EEPROM
|
FLASH
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
SYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
256KX8
|
256KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
SOP
|
HVSON
|
| Package Equivalence Code |
SOP8,.25
|
SOLCC8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
0.8 mm
|
| Serial Bus Type |
I2C
|
SPI
|
| Standby Current-Max |
0.000001 A
|
0.00001 A
|
| Supply Current-Max |
0.005 mA
|
0.025 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.3 V
|
| Supply Voltage-Min (Vsup) |
1.8 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
3.9 mm
|
5 mm
|
| Write Cycle Time-Max (tWC) |
5 ms
|
|
| Write Protection |
HARDWARE
|
HARDWARE/SOFTWARE
|
| Base Number Matches |
1
|
3
|
| Additional Feature |
|
SYNCHRONOUS MODE ALSO POSSIBLE
|
| Output Characteristics |
|
3-STATE
|
| Programming Voltage |
|
3 V
|
| Type |
|
NOR TYPE
|
|
|
|
Compare M24M01-HRMN6TP with alternatives
Compare W25X20LZPI with alternatives