M24C64-WDW3/B
vs
M24C64-WDW5PP
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
SOIC
SOIC
Package Description
0.169 INCH, TSSOP-8
TSSOP,
Pin Count
8
8
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.51
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e0
e3
Length
4.4 mm
4.4 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-20 °C
Organization
8KX8
8KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Screening Level
AEC-Q100
Seated Height-Max
1.2 mm
1.2 mm
Supply Current-Max
0.005 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.5 V
2.5 V
Supply Voltage-Nom (Vsup)
3.3 V
2.7 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
AUTOMOTIVE
OTHER
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
3 mm
3 mm
Base Number Matches
1
1
Clock Frequency-Max (fCLK)
0.4 MHz
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Serial Bus Type
I2C
Time@Peak Reflow Temperature-Max (s)
30
Write Cycle Time-Max (tWC)
5 ms
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