M24C64-WCS3P/A vs X84640ZE-2.5 feature comparison

M24C64-WCS3P/A STMicroelectronics

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X84640ZE-2.5 IC Microsystems Sdn Bhd

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS IC MICROSYSTEMS SDN BHD
Part Package Code BGA BGA
Package Description 0.50 MM PITCH, ROHS COMPLIANT, WLCSP-8 VBGA,
Pin Count 8 8
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
I2C Control Byte 1010DDDR
JESD-30 Code R-XBCS-B8 R-XBGA-B8
Length 1.805 mm 3.912 mm
Memory Density 65536 bit 65536 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -20 °C
Organization 8KX8 8KX8
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code CSP VBGA
Package Equivalence Code BGA8,3X5,44/25
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP SCALE GRID ARRAY, VERY THIN PROFILE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.635 mm 0.61 mm
Serial Bus Type I2C 3-WIRE
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.5 V 2.5 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE OTHER
Terminal Form BALL BALL
Terminal Pitch 0.44 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 1.4 mm 1.982 mm
Write Protection HARDWARE
Base Number Matches 1 2
Clock Frequency-Max (fCLK) 5 MHz
JESD-609 Code e0
Moisture Sensitivity Level 3
Supply Current-Max 0.002 mA
Terminal Finish TIN LEAD
Write Cycle Time-Max (tWC) 5 ms

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