M24C64-WBN6TG
vs
M24C64-WBN6G/C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Not Recommended
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
DIP
DIP
Package Description
DIP, DIP8,.3
DIP, DIP8,.3
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Endurance
1000000 Write/Erase Cycles
1000000 Write/Erase Cycles
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e3
e3
Length
9.27 mm
9.27 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8KX8
8KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.33 mm
5.33 mm
Standby Current-Max
0.000002 A
0.000002 A
Supply Current-Max
0.0025 mA
0.005 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.5 V
2.5 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
7.62 mm
Write Protection
HARDWARE
HARDWARE
Base Number Matches
4
1
Compare M24C64-WBN6TG with alternatives
Compare M24C64-WBN6G/C with alternatives