M24C32-RMB5T/B
vs
M24C32-FMB6/C
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
2 X 3 MM, MLP-8
|
HVSON,
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Clock Frequency-Max (fCLK) |
0.4 MHz
|
0.4 MHz
|
I2C Control Byte |
1010DDDR
|
1010DDDR
|
JESD-30 Code |
R-XDSO-N8
|
R-XDSO-N8
|
JESD-609 Code |
e0
|
e0
|
Length |
3 mm
|
3 mm
|
Memory Density |
32768 bit
|
32768 bit
|
Memory IC Type |
EEPROM
|
EEPROM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Number of Words |
4096 words
|
4096 words
|
Number of Words Code |
4000
|
4000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-20 °C
|
-40 °C
|
Organization |
4KX8
|
4KX8
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVSON
|
HVSON
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
AEC-Q100
|
AEC-Q100
|
Seated Height-Max |
0.6 mm
|
0.6 mm
|
Serial Bus Type |
I2C
|
I2C
|
Supply Current-Max |
0.003 mA
|
0.003 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.8 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL EXTENDED
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
2 mm
|
2 mm
|
Write Cycle Time-Max (tWC) |
5 ms
|
10 ms
|
Base Number Matches |
2
|
1
|
|
|
|
Compare M24C32-RMB5T/B with alternatives
Compare M24C32-FMB6/C with alternatives