M24C32-FMB3/P
vs
M24C32-FMB6P/B
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
SOIC
SOIC
Package Description
2 X 3 MM, MLP-8
2 X 3 MM, ROHS COMPLIANT, MLP-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
0.4 MHz
0.4 MHz
I2C Control Byte
1010DDDR
1010DDDR
JESD-30 Code
R-XDSO-N8
R-XDSO-N8
JESD-609 Code
e0
Length
3 mm
3 mm
Memory Density
32768 bit
32768 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
4KX8
4KX8
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
HVSON
HVSON
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Screening Level
AEC-Q100
AEC-Q100
Seated Height-Max
0.6 mm
0.6 mm
Serial Bus Type
I2C
I2C
Supply Current-Max
0.003 mA
0.003 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Width
2 mm
2 mm
Write Cycle Time-Max (tWC)
10 ms
10 ms
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare M24C32-FMB3/P with alternatives
Compare M24C32-FMB6P/B with alternatives