M24C32-FDW5T
vs
M24C32-FDW5
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
| Package Description |
TSSOP, TSSOP8,.25
|
TSSOP, TSSOP8,.25
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Data Retention Time-Min |
40
|
40
|
| Endurance |
1000000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
| I2C Control Byte |
1010DDDR
|
1010DDDR
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| Memory Density |
32768 bit
|
32768 bit
|
| Memory IC Type |
EEPROM CARD
|
EEPROM CARD
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
4096 words
|
4096 words
|
| Number of Words Code |
4000
|
4000
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-20 °C
|
| Organization |
4KX8
|
4KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP8,.25
|
TSSOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Programming Voltage |
2.7 V
|
2.7 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
AEC-Q100
|
AEC-Q100
|
| Serial Bus Type |
I2C
|
I2C
|
| Standby Current-Max |
0.000001 A
|
0.000001 A
|
| Supply Current-Max |
0.003 mA
|
0.003 mA
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.635 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Write Protection |
HARDWARE
|
HARDWARE
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare M24C32-FDW5T with alternatives
Compare M24C32-FDW5 with alternatives