M24C16-WDW3T/G
vs
M95128-RMN3T/V
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
0.169 INCH, TSSOP-8
|
SOP,
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
compliant
|
Clock Frequency-Max (fCLK) |
0.4 MHz
|
5 MHz
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
JESD-609 Code |
e3
|
e0
|
Length |
4.4 mm
|
4.9 mm
|
Memory Density |
16384 bit
|
131072 bit
|
Memory IC Type |
EEPROM
|
EEPROM
|
Memory Width |
8
|
8
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Number of Words |
2048 words
|
16384 words
|
Number of Words Code |
2000
|
16000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
2KX8
|
16KX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Peak Reflow Temperature (Cel) |
260
|
240
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.75 mm
|
Serial Bus Type |
I2C
|
SPI
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
1.8 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
3 mm
|
3.9 mm
|
Write Cycle Time-Max (tWC) |
10 ms
|
5 ms
|
Base Number Matches |
1
|
1
|
|
|
|
Compare M24C16-WDW3T/G with alternatives
Compare M95128-RMN3T/V with alternatives