M24C16-WBN3TP/G vs M24C16-WBN3T/G feature comparison

M24C16-WBN3TP/G STMicroelectronics

Buy Now Datasheet

M24C16-WBN3T/G STMicroelectronics

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Clock Frequency-Max (fCLK) 0.4 MHz 0.4 MHz
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e3 e3
Length 9.27 mm 9.27 mm
Memory Density 16384 bit 16384 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2KX8 2KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Screening Level AEC-Q100
Seated Height-Max 5.33 mm 5.33 mm
Serial Bus Type I2C I2C
Supply Current-Max 0.003 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.5 V 2.5 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount NO NO
Technology CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish MATTE TIN MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Write Cycle Time-Max (tWC) 10 ms 10 ms
Base Number Matches 1 1
Moisture Sensitivity Level NOT APPLICABLE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare M24C16-WBN3TP/G with alternatives

Compare M24C16-WBN3T/G with alternatives