M24C08-WDW6TP/S
vs
M24C08WDW6
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Package Description
TSSOP,
TSSOP,
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.51
Clock Frequency-Max (fCLK)
0.4 MHz
0.4 MHz
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
Length
4.4 mm
4.4 mm
Memory Density
8192 bit
8192 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1KX8
1KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial
SERIAL
SERIAL
Seated Height-Max
1.2 mm
1.2 mm
Serial Bus Type
SPI
I2C
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.5 V
2.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
3 mm
3 mm
Write Cycle Time-Max (tWC)
5 ms
5 ms
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
SOIC
Pin Count
8
JESD-609 Code
e0
Output Characteristics
OPEN-DRAIN
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Terminal Finish
Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare M24C08-WDW6TP/S with alternatives
Compare M24C08WDW6 with alternatives