M24C08-WDW5TP/S
vs
M24C08-WDW3T/S
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
Package Description |
,
|
0.169 INCH, TSSOP-8
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Memory IC Type |
EEPROM
|
EEPROM
|
Serial Bus Type |
SPI
|
I2C
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Part Package Code |
|
SOIC
|
Pin Count |
|
8
|
Clock Frequency-Max (fCLK) |
|
0.4 MHz
|
Data Retention Time-Min |
|
40
|
Endurance |
|
1000000 Write/Erase Cycles
|
I2C Control Byte |
|
1010DMMR
|
JESD-30 Code |
|
R-PDSO-G8
|
JESD-609 Code |
|
e0
|
Length |
|
4.4 mm
|
Memory Density |
|
8192 bit
|
Memory Width |
|
8
|
Number of Functions |
|
1
|
Number of Terminals |
|
8
|
Number of Words |
|
1024 words
|
Number of Words Code |
|
1000
|
Operating Mode |
|
SYNCHRONOUS
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
|
1KX8
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
TSSOP
|
Package Equivalence Code |
|
TSSOP8,.25
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Parallel/Serial |
|
SERIAL
|
Qualification Status |
|
Not Qualified
|
Screening Level |
|
AEC-Q100
|
Seated Height-Max |
|
1.2 mm
|
Standby Current-Max |
|
0.000002 A
|
Supply Current-Max |
|
0.003 mA
|
Supply Voltage-Max (Vsup) |
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
2.5 V
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
AUTOMOTIVE
|
Terminal Finish |
|
TIN LEAD
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
0.65 mm
|
Terminal Position |
|
DUAL
|
Width |
|
3 mm
|
Write Cycle Time-Max (tWC) |
|
5 ms
|
Write Protection |
|
HARDWARE
|
|
|
|
Compare M24C08-WDW5TP/S with alternatives
Compare M24C08-WDW3T/S with alternatives