M24C08-BN3TP/G
vs
M24C08-BN3TG/G
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
DIP
DIP
Package Description
DIP,
DIP,
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
0.4 MHz
0.4 MHz
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e3
e3
Length
9.27 mm
9.27 mm
Memory Density
8192 bit
8192 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1KX8
1KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Screening Level
AEC-Q100
AEC-Q100
Seated Height-Max
5.33 mm
5.33 mm
Serial Bus Type
I2C
I2C
Supply Current-Max
0.003 mA
0.003 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Write Cycle Time-Max (tWC)
10 ms
10 ms
Base Number Matches
1
1
Compare M24C08-BN3TP/G with alternatives
Compare M24C08-BN3TG/G with alternatives