M24C04-WDW3
vs
M24C04-WDW5TP/S
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
| Part Package Code |
SOIC
|
|
| Package Description |
0.169 INCH, TSSOP-8
|
,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
0.4 MHz
|
|
| Data Retention Time-Min |
40
|
|
| Endurance |
1000000 Write/Erase Cycles
|
|
| I2C Control Byte |
1010DDMR
|
|
| JESD-30 Code |
R-PDSO-G8
|
|
| JESD-609 Code |
e0
|
|
| Length |
4.4 mm
|
|
| Memory Density |
4096 bit
|
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
8
|
|
| Number of Words |
512 words
|
|
| Number of Words Code |
512
|
|
| Operating Mode |
SYNCHRONOUS
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
512X8
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TSSOP
|
|
| Package Equivalence Code |
TSSOP8,.25
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
| Parallel/Serial |
SERIAL
|
|
| Qualification Status |
Not Qualified
|
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.2 mm
|
|
| Serial Bus Type |
I2C
|
SPI
|
| Standby Current-Max |
0.000002 A
|
|
| Supply Current-Max |
0.003 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
|
| Width |
3 mm
|
|
| Write Cycle Time-Max (tWC) |
10 ms
|
|
| Write Protection |
HARDWARE
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare M24C04-WDW3 with alternatives
Compare M24C04-WDW5TP/S with alternatives