M24C04-WBN3G
vs
M24C04-WDW3P
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
DIP
SOIC
Package Description
DIP, DIP8,.3
0.169 INCH, LEAD FREE, TSSOP-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
0.4 MHz
0.4 MHz
Data Retention Time-Min
40
40
Endurance
1000000 Write/Erase Cycles
1000000 Write/Erase Cycles
I2C Control Byte
1010DDMR
1010DDMR
JESD-30 Code
R-PDIP-T8
R-PDSO-G8
JESD-609 Code
e3
e4
Length
9.27 mm
4.4 mm
Memory Density
4096 bit
4096 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512X8
512X8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
TSSOP
Package Equivalence Code
DIP8,.3
TSSOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Screening Level
AEC-Q100
AEC-Q100
Seated Height-Max
5.33 mm
1.2 mm
Serial Bus Type
I2C
I2C
Standby Current-Max
0.000002 A
0.000002 A
Supply Current-Max
0.003 mA
0.003 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.5 V
2.5 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
MATTE TIN
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
3 mm
Write Cycle Time-Max (tWC)
10 ms
10 ms
Write Protection
HARDWARE
HARDWARE
Base Number Matches
1
1
Moisture Sensitivity Level
1
Compare M24C04-WBN3G with alternatives
Compare M24C04-WDW3P with alternatives