M24C04-WBN3/G vs SLA25C160-D/P feature comparison

M24C04-WBN3/G STMicroelectronics

Buy Now Datasheet

SLA25C160-D/P Siemens

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer STMICROELECTRONICS SIEMENS A G
Part Package Code DIP
Package Description DIP, ,
Pin Count 8
Reach Compliance Code compliant unknown
Clock Frequency-Max (fCLK) 0.4 MHz 2.1 MHz
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e3
Length 9.27 mm
Memory Density 4096 bit 16384 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Moisture Sensitivity Level NOT APPLICABLE
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 512 words 2048 words
Number of Words Code 512 2000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512X8 2KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.33 mm
Serial Bus Type I2C SPI
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.5 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount NO NO
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm
Write Cycle Time-Max (tWC) 10 ms 8 ms
Base Number Matches 5 1
ECCN Code EAR99
HTS Code 8542.32.00.51
Additional Feature SPI BUS INTERFACE; 32 BYTE PAGE MODE; 40 YEARS DATA RETENTION
Data Retention Time-Min 40
Technology CMOS

Compare M24C04-WBN3/G with alternatives

Compare SLA25C160-D/P with alternatives