M24C04-WBN1T vs M24C04-WBN3T/G feature comparison

M24C04-WBN1T STMicroelectronics

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M24C04-WBN3T/G STMicroelectronics

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Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Part Package Code DIP DIP
Package Description 0.25 MM LEAD FRAME, SKINNY, PLASTIC, DIP-8 PLASTIC, DIP-8
Pin Count 8 8
Reach Compliance Code not_compliant compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Clock Frequency-Max (fCLK) 0.4 MHz 0.4 MHz
Data Retention Time-Min 40
Endurance 1000000 Write/Erase Cycles
I2C Control Byte 1010DDMR
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e0 e3
Length 9.55 mm 9.27 mm
Memory Density 4096 bit 4096 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -40 °C
Organization 512X8 512X8
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.9 mm 5.33 mm
Serial Bus Type I2C I2C
Standby Current-Max 5e-7 A
Supply Current-Max 0.001 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.5 V 2.5 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount NO NO
Technology CMOS
Temperature Grade COMMERCIAL AUTOMOTIVE
Terminal Finish TIN LEAD MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Write Cycle Time-Max (tWC) 10 ms 10 ms
Write Protection HARDWARE
Base Number Matches 1 5
Pbfree Code Yes
Moisture Sensitivity Level NOT APPLICABLE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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