M24C04-WBN1
vs
M24C04-WBN3T/W
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
DIP
DIP
Package Description
0.25 MM LEAD FRAME, SKINNY, PLASTIC, DIP-8
PLASTIC, DIP-8
Pin Count
8
8
Reach Compliance Code
compliant
not_compliant
Clock Frequency-Max (fCLK)
0.4 MHz
0.4 MHz
Data Retention Time-Min
40
Endurance
1000000 Write/Erase Cycles
I2C Control Byte
1010DDMR
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e0
e0
Length
9.55 mm
9.27 mm
Memory Density
4096 bit
4096 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-40 °C
Organization
512X8
512X8
Output Characteristics
OPEN-DRAIN
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
245
Power Supplies
3/5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.9 mm
5.33 mm
Serial Bus Type
I2C
I2C
Standby Current-Max
5e-7 A
Supply Current-Max
0.001 mA
0.003 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.5 V
2.5 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
AUTOMOTIVE
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn60Pb40)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
7.62 mm
Write Cycle Time-Max (tWC)
10 ms
10 ms
Write Protection
HARDWARE
Base Number Matches
1
1
ECCN Code
EAR99
HTS Code
8542.32.00.51
Screening Level
AEC-Q100
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