M24C02-RDW5TP
vs
M24C02-RDW5P
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
| Part Package Code |
SOIC
|
|
| Package Description |
0.169 INCH, ROHS COMPLIANT, TSSOP-8
|
,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
0.4 MHz
|
|
| JESD-30 Code |
R-PDSO-G8
|
|
| JESD-609 Code |
e3
|
|
| Length |
4.4 mm
|
|
| Memory Density |
2048 bit
|
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
8
|
|
| Number of Words |
256 words
|
|
| Number of Words Code |
256
|
|
| Operating Mode |
SYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-20 °C
|
|
| Organization |
256X8
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TSSOP
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
| Parallel/Serial |
SERIAL
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.2 mm
|
|
| Serial Bus Type |
I2C
|
I2C
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
1.8 V
|
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
3 mm
|
|
| Write Cycle Time-Max (tWC) |
5 ms
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare M24C02-RDW5TP with alternatives
Compare M24C02-RDW5P with alternatives