M24C02-RDW5TP/S
vs
M24C02-DRDW3TP/K
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
| Package Description |
,
|
TSSOP-8
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Serial Bus Type |
SPI
|
I2C
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Samacsys Manufacturer |
|
STMicroelectronics
|
| Clock Frequency-Max (fCLK) |
|
1 MHz
|
| Data Retention Time-Min |
|
50
|
| Endurance |
|
600000 Write/Erase Cycles
|
| JESD-30 Code |
|
R-PDSO-G8
|
| Length |
|
4.4 mm
|
| Memory Density |
|
2048 bit
|
| Memory Width |
|
8
|
| Moisture Sensitivity Level |
|
1
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
8
|
| Number of Words |
|
256 words
|
| Number of Words Code |
|
256
|
| Operating Mode |
|
SYNCHRONOUS
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
256X8
|
| Output Characteristics |
|
3-STATE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TSSOP8,.25
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Parallel/Serial |
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Programming Voltage |
|
2.5 V
|
| Screening Level |
|
AEC-Q100
|
| Seated Height-Max |
|
1.2 mm
|
| Standby Current-Max |
|
0.00002 A
|
| Supply Current-Max |
|
0.002 mA
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
|
2.5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
3 mm
|
| Write Protection |
|
HARDWARE
|
|
|
|
Compare M24C02-RDW5TP/S with alternatives
Compare M24C02-DRDW3TP/K with alternatives