M24C01-BN3/G
vs
IS24C01-PI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
INTEGRATED SILICON SOLUTION INC
Part Package Code
DIP
DIP
Package Description
DIP, DIP8,.3
0.300 INCH, PLASTIC, DIP-8
Pin Count
8
8
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
0.4 MHz
0.4 MHz
Data Retention Time-Min
40
10
Endurance
1000000 Write/Erase Cycles
100000 Write/Erase Cycles
I2C Control Byte
1010DDDR
1010DDDR
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e3
e0
Length
9.27 mm
9.3218 mm
Memory Density
1024 bit
1024 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
128 words
128 words
Number of Words Code
128
128
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128X8
128X8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Screening Level
AEC-Q100
Seated Height-Max
5.33 mm
4.572 mm
Serial Bus Type
I2C
I2C
Standby Current-Max
0.000005 A
0.000018 A
Supply Current-Max
0.003 mA
0.002 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Write Cycle Time-Max (tWC)
10 ms
10 ms
Write Protection
HARDWARE
HARDWARE
Base Number Matches
1
1
Additional Feature
2 WIRE SERIAL INTERFACE; HARDWARE WRITE PROTECTION; 100K ENDURANCE CYCLES
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