M24C01-BN1
vs
24LC16BI/SL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
STMICROELECTRONICS
MICROCHIP TECHNOLOGY INC
Part Package Code
DIP
SOIC
Package Description
DIP, DIP8,.3
0.150 INCH, PLASTIC, SOIC-14
Pin Count
8
14
Reach Compliance Code
compliant
compliant
Clock Frequency-Max (fCLK)
0.4 MHz
0.1 MHz
Data Retention Time-Min
40
200
Endurance
1000000 Write/Erase Cycles
1000000 Write/Erase Cycles
I2C Control Byte
1010DDDR
1010MMMR
JESD-30 Code
R-PDIP-T8
R-PDSO-G14
JESD-609 Code
e0
e3
Length
9.55 mm
9.271 mm
Memory Density
1024 bit
16384 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
14
Number of Words
128 words
2048 words
Number of Words Code
128
2000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
128X8
2KX8
Output Characteristics
OPEN-DRAIN
OPEN-DRAIN
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP8,.3
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
245
260
Power Supplies
5 V
3/5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.9 mm
1.728 mm
Serial Bus Type
I2C
I2C
Standby Current-Max
0.000001 A
0.00003 A
Supply Current-Max
0.002 mA
0.003 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
2.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Matte Tin (Sn)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
40
Width
7.62 mm
3.9 mm
Write Cycle Time-Max (tWC)
5 ms
10 ms
Write Protection
HARDWARE
HARDWARE
Base Number Matches
1
1
Pbfree Code
Moisture Sensitivity Level
1
Compare M24C01-BN1 with alternatives
Compare 24LC16BI/SL with alternatives