M24C01-BN1
vs
93LCS66-I/P
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP, DIP8,.3
|
DIP, DIP8,.3
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
unknown
|
| Clock Frequency-Max (fCLK) |
0.4 MHz
|
2 MHz
|
| Data Retention Time-Min |
40
|
200
|
| Endurance |
1000000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
| I2C Control Byte |
1010DDDR
|
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
| JESD-609 Code |
e0
|
e0
|
| Length |
9.55 mm
|
9.46 mm
|
| Memory Density |
1024 bit
|
4096 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
128 words
|
256 words
|
| Number of Words Code |
128
|
256
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
128X8
|
256X16
|
| Output Characteristics |
OPEN-DRAIN
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP8,.3
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
245
|
NOT SPECIFIED
|
| Power Supplies |
5 V
|
3/5 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.9 mm
|
4.32 mm
|
| Serial Bus Type |
I2C
|
MICROWIRE
|
| Standby Current-Max |
0.000001 A
|
0.00003 A
|
| Supply Current-Max |
0.002 mA
|
0.003 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
2.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
7.62 mm
|
7.62 mm
|
| Write Cycle Time-Max (tWC) |
5 ms
|
10 ms
|
| Write Protection |
HARDWARE
|
HARDWARE/SOFTWARE
|
| Base Number Matches |
3
|
2
|
| Additional Feature |
|
100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS
|
|
|
|
Compare M24C01-BN1 with alternatives
Compare 93LCS66-I/P with alternatives