M24256-BWDW6TP/K vs M24256-BWDW3TG/AB feature comparison

M24256-BWDW6TP/K STMicroelectronics

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M24256-BWDW3TG/AB STMicroelectronics

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Part Package Code SOIC
Package Description ROHS COMPLIANT, TSSOP-8
Pin Count 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Alternate Memory Width 1
Clock Frequency-Max (fCLK) 0.4 MHz
Data Retention Time-Min 40 40
Endurance 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
I2C Control Byte 1010DDDR 1010DDDR
JESD-30 Code R-PDSO-G8 R-PDSO-G8
Length 4.4 mm
Memory Density 262144 bit 262144 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1
Number of Terminals 8 8
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 32KX8 32KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP8,.25 TSSOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Serial Bus Type I2C I2C
Standby Current-Max 0.000002 A 0.000005 A
Supply Current-Max 0.005 mA 0.005 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.635 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3 mm
Write Cycle Time-Max (tWC) 5 ms
Write Protection HARDWARE HARDWARE
Base Number Matches 1 1
JESD-609 Code e3
Moisture Sensitivity Level 1
Screening Level AEC-Q100
Terminal Finish MATTE TIN

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