M24256-BWCS6TG/K
vs
X24256BIG-2.5
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
IC MICROSYSTEMS SDN BHD
|
| Package Description |
VFBGA, BGA8,3X5,14/8
|
BGA, BGA8,2X4,40/32
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
1 MHz
|
0.4 MHz
|
| Data Retention Time-Min |
200
|
100
|
| Endurance |
4000000 Write/Erase Cycles
|
100000 Write/Erase Cycles
|
| I2C Control Byte |
1010DDDR
|
10100DDR
|
| JESD-30 Code |
R-XBGA-B8
|
R-PBGA-B8
|
| Length |
1.379 mm
|
3.4798 mm
|
| Memory Density |
262144 bit
|
262144 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
32768 words
|
32768 words
|
| Number of Words Code |
32000
|
32000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
32KX8
|
32KX8
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
BGA
|
| Package Equivalence Code |
BGA8(UNSPEC)
|
BGA8,2X4,40/32
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Programming Voltage |
5 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.58 mm
|
|
| Serial Bus Type |
I2C
|
I2C
|
| Standby Current-Max |
0.000002 A
|
0.001 A
|
| Supply Current-Max |
0.0025 mA
|
0.003 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.4 mm
|
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
1.289 mm
|
2 mm
|
| Write Cycle Time-Max (tWC) |
5 ms
|
10 ms
|
| Write Protection |
HARDWARE
|
HARDWARE
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
8
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare M24256-BWCS6TG/K with alternatives
Compare X24256BIG-2.5 with alternatives