M24256-BRCS6P/A vs X24257Z-2.5 feature comparison

M24256-BRCS6P/A STMicroelectronics

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X24257Z-2.5 Xicor Inc

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS XICOR INC
Part Package Code BGA
Package Description 0.50 PITCH, ROHS COMPLIANT, WLCSP-8 BGA,
Pin Count 8
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Alternate Memory Width 1
Clock Frequency-Max (fCLK) 0.4 MHz 0.4 MHz
Data Retention Time-Min 40 100
Endurance 1000000 Write/Erase Cycles 100000 Write/Erase Cycles
I2C Control Byte 1010DDDR
JESD-30 Code R-PBGA-B8 R-PBGA-B8
Length 1.97 mm 3.4798 mm
Memory Density 262144 bit 262144 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 32KX8 32KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA BGA
Package Equivalence Code BGA8,3X5,17/10
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.65 mm
Serial Bus Type I2C I2C
Standby Current-Max 0.000001 A
Supply Current-Max 0.005 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.8 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 1.785 mm 2 mm
Write Cycle Time-Max (tWC) 5 ms 10 ms
Write Protection HARDWARE
Base Number Matches 1 2
Additional Feature 100 YEARS DATA RETENTION, 100000 ENDURANCE CYCLES
Supply Voltage-Nom (Vsup) 5 V

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