M24128-BWDW3G/B
vs
M24128-BWDW3T/P
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
SOIC
SOIC
Package Description
TSSOP,
TSSOP,
Pin Count
8
8
Reach Compliance Code
compliant
compliant
Clock Frequency-Max (fCLK)
0.4 MHz
0.4 MHz
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e3
e0
Length
4.4 mm
4.4 mm
Memory Density
131072 bit
131072 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
16KX8
16KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
260
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Serial Bus Type
I2C
I2C
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.5 V
2.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
3 mm
3 mm
Write Cycle Time-Max (tWC)
5 ms
5 ms
Base Number Matches
1
1
Compare M24128-BWDW3G/B with alternatives
Compare M24128-BWDW3T/P with alternatives