M1AGL250V5-CSG196
vs
AGL250V5-CS196
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
| Package Description |
TFBGA, BGA196,14X14,20
|
TFBGA,
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B196
|
S-PBGA-B196
|
| JESD-609 Code |
e1
|
|
| Length |
8 mm
|
8 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of CLBs |
6144
|
6144
|
| Number of Equivalent Gates |
250000
|
250000
|
| Number of Inputs |
143
|
|
| Number of Logic Cells |
6144
|
|
| Number of Outputs |
143
|
|
| Number of Terminals |
196
|
196
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
6144 CLBS, 250000 GATES
|
6144 CLBS, 250000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TFBGA
|
| Package Equivalence Code |
BGA196,14X14,20
|
BGA196,14X14,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.425 V
|
1.425 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
OTHER
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
8 mm
|
8 mm
|
| Base Number Matches |
3
|
3
|
| Clock Frequency-Max |
|
108 MHz
|
|
|
|
Compare M1AGL250V5-CSG196 with alternatives
Compare AGL250V5-CS196 with alternatives