M1AGL1000V5-FGG484I
vs
AGL1000V5-CS281
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
BGA,
10 X 10 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, CSP-281
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
108 MHz
108 MHz
JESD-30 Code
S-PBGA-B484
S-PBGA-B281
JESD-609 Code
e1
Length
23 mm
10 mm
Moisture Sensitivity Level
3
Number of CLBs
24576
Number of Equivalent Gates
1000000
1000000
Number of Terminals
484
281
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
24576 CLBS, 1000000 GATES
24576 CLBS, 1000000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
TFBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
250
NOT SPECIFIED
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.44 mm
1.05 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
23 mm
10 mm
Base Number Matches
3
3
Factory Lead Time
8 Weeks
Number of Inputs
215
Number of Logic Cells
24576
Number of Outputs
215
Package Equivalence Code
BGA281,19X19,20
Compare M1AGL1000V5-FGG484I with alternatives
Compare AGL1000V5-CS281 with alternatives