M1AFS600-FG484YI
vs
M1AFS600-FG484
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI SOC PRODUCTS GROUP
MICROCHIP TECHNOLOGY INC
Package Description
,
FBGA-484
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
TERM PITCH-MIN
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B256
S-PBGA-B484
JESD-609 Code
e0
e0
Length
17 mm
23 mm
Moisture Sensitivity Level
3
3
Number of Equivalent Gates
600000
600000
Number of Terminals
256
484
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
600000 GATES
600000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
1.7 mm
2.44 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
17 mm
23 mm
Base Number Matches
3
3
Rohs Code
Factory Lead Time
16 Weeks
Number of Inputs
172
Number of Logic Cells
13824
Number of Outputs
172
Package Equivalence Code
BGA484,22X22,40
Qualification Status
Not Qualified
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