M1AFS600-FG256I
vs
AFS600-1FGG256
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
FBGA-256
FBGA-256
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
16 Weeks
14 Weeks
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of Equivalent Gates
600000
600000
Number of Inputs
119
119
Number of Logic Cells
13824
Number of Outputs
119
119
Number of Terminals
256
256
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
600000 GATES
13824 CLBS, 600000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.68 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
17 mm
17 mm
Base Number Matches
1
22
JESD-609 Code
e1
Number of CLBs
13824
Packing Method
TRAY
Peak Reflow Temperature (Cel)
250
Terminal Finish
TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s)
30
Compare M1AFS600-FG256I with alternatives
Compare AFS600-1FGG256 with alternatives