M1AFS600-2FG484
vs
AFS600-1FGG484
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ACTEL CORP
MICROSEMI CORP
Package Description
1 MM PITCH, FBGA-484
BGA,
Reach Compliance Code
compliant
compliant
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B484
S-PBGA-B484
JESD-609 Code
e0
e1
Length
23 mm
23 mm
Moisture Sensitivity Level
3
3
Number of CLBs
13824
13824
Number of Equivalent Gates
600000
600000
Number of Inputs
172
Number of Logic Cells
13824
Number of Outputs
172
Number of Terminals
484
484
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
13824 CLBS, 600000 GATES
13824 CLBS, 600000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA484,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.44 mm
2.44 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
23 mm
23 mm
Base Number Matches
3
3
HTS Code
8542.39.00.01
Samacsys Manufacturer
Microsemi Corporation
Peak Reflow Temperature (Cel)
250
Time@Peak Reflow Temperature-Max (s)
30
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