M1AFS600-1FGG484YK
vs
M1AFS600-1FG484K
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B484
S-PBGA-B484
JESD-609 Code
e1
e0
Length
23 mm
Moisture Sensitivity Level
3
3
Number of Equivalent Gates
600000
600000
Number of Inputs
172
172
Number of Logic Cells
13824
13824
Number of Outputs
172
172
Number of Terminals
484
484
Operating Temperature-Max
100 °C
100 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
13824 CLBS, 600000 GATES
13824 CLBS, 600000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA484,22X22,40
BGA484,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
2.44 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
23 mm
Base Number Matches
1
1
Factory Lead Time
16 Weeks
Packing Method
TRAY
Qualification Status
Not Qualified
Compare M1AFS600-1FGG484YK with alternatives
Compare M1AFS600-1FG484K with alternatives