M1AFS600-1FGG484YI
vs
M1AFS600-FGG484
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
FPBGA-256
FBGA-484
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
TERM PITCH-MIN
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B256
S-PBGA-B484
JESD-609 Code
e1
e1
Length
17 mm
23 mm
Moisture Sensitivity Level
3
3
Number of Equivalent Gates
600000
600000
Number of Terminals
256
484
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
600000 GATES
13824 CLBS, 600000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Peak Reflow Temperature (Cel)
250
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
1.7 mm
2.44 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
17 mm
23 mm
Base Number Matches
3
3
Factory Lead Time
16 Weeks
Number of CLBs
13824
Packing Method
TRAY
Qualification Status
Not Qualified
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