M1AFS600-1FGG484Y
vs
M1AFS600-1FGG484YK
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI SOC PRODUCTS GROUP
MICROSEMI CORP
Package Description
,
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
TERM PITCH-MIN
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B256
JESD-609 Code
e1
e1
Length
17 mm
Moisture Sensitivity Level
3
3
Number of Equivalent Gates
600000
Number of Terminals
256
Operating Temperature-Max
85 °C
Operating Temperature-Min
Organization
600000 GATES
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
250
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
1.7 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.425 V
Supply Voltage-Nom
1.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
OTHER
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
17 mm
Base Number Matches
3
3
Rohs Code