M1AFS600-1FGG484Y vs M1AFS600-1FG484Y feature comparison

M1AFS600-1FGG484Y Microsemi FPGA & SoC

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M1AFS600-1FG484Y Microchip Technology Inc

Buy Now Datasheet
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI SOC PRODUCTS GROUP MICROCHIP TECHNOLOGY INC
Package Description ,
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature TERM PITCH-MIN
Clock Frequency-Max 350 MHz
JESD-30 Code S-PBGA-B256 S-PBGA-B484
JESD-609 Code e1 e0
Length 17 mm 23 mm
Moisture Sensitivity Level 3 3
Number of Equivalent Gates 600000 600000
Number of Terminals 256 484
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 600000 GATES 600000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Peak Reflow Temperature (Cel) 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 1.7 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 17 mm 23 mm
Base Number Matches 3 3
Rohs Code No
Number of Inputs 172
Number of Logic Cells 13824
Number of Outputs 172
Package Equivalence Code BGA484,22X22,40

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