M1AFS600-1FG484I vs M1AFS600-1FG484Y feature comparison

M1AFS600-1FG484I Microsemi Corporation

Buy Now Datasheet

M1AFS600-1FG484Y Microsemi FPGA & SoC

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI SOC PRODUCTS GROUP
Package Description BGA, ,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B484 S-PBGA-B256
JESD-609 Code e0 e0
Length 23 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 13824
Number of Equivalent Gates 600000 600000
Number of Terminals 484 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 13824 CLBS, 600000 GATES 600000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.44 mm 1.7 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 23 mm 17 mm
Base Number Matches 3 3
Additional Feature TERM PITCH-MIN
Clock Frequency-Max 350 MHz

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