M1AFS600-1FG484
vs
M1AFS600-FG484Y
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Package Description
BGA,
FPBGA-256
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B484
S-PBGA-B256
JESD-609 Code
e0
e0
Length
23 mm
17 mm
Moisture Sensitivity Level
3
3
Number of CLBs
13824
Number of Equivalent Gates
600000
600000
Number of Terminals
484
256
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
13824 CLBS, 600000 GATES
600000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Seated Height-Max
2.44 mm
1.7 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
23 mm
17 mm
Base Number Matches
3
3
Additional Feature
TERM PITCH-MIN
Clock Frequency-Max
350 MHz
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