M1AFS1500-1FG676 vs M1AFS1500-1FGG676I feature comparison

M1AFS1500-1FG676 Microsemi Corporation

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M1AFS1500-1FGG676I Microsemi Corporation

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description BGA, BGA,
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B676 S-PBGA-B676
JESD-609 Code e0 e1
Length 25 mm 25 mm
Moisture Sensitivity Level 3 3
Number of CLBs 38400 38400
Number of Equivalent Gates 1500000 1500000
Number of Terminals 676 676
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 38400 CLBS, 1500000 GATES 38400 CLBS, 1500000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA676,26X26,40 BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 25 mm 25 mm
Base Number Matches 3 3
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30

Compare M1AFS1500-1FG676 with alternatives

Compare M1AFS1500-1FGG676I with alternatives