M1AFS1500-1FG676
vs
M1AFS1500-2FGG676
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
FBGA-676
FBGA-676
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B676
S-PBGA-B676
JESD-609 Code
e0
e1
Length
25 mm
25 mm
Moisture Sensitivity Level
3
3
Number of Equivalent Gates
1500000
1500000
Number of Inputs
252
Number of Logic Cells
38400
Number of Outputs
252
Number of Terminals
676
676
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
1500000 GATES
38400 CLBS, 1500000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA676,26X26,40
BGA676,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.44 mm
2.44 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
25 mm
25 mm
Base Number Matches
4
4
Number of CLBs
38400
Peak Reflow Temperature (Cel)
250
Time@Peak Reflow Temperature-Max (s)
30
Compare M1AFS1500-1FG676 with alternatives
Compare M1AFS1500-2FGG676 with alternatives