M1A3PE3000L-1FGG896M
vs
M1A3PE3000L-1FGG896Y
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
1 MM PITCH, GREEN, FBGA-896
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
20 Weeks
|
|
| Clock Frequency-Max |
250 MHz
|
250 MHz
|
| JESD-30 Code |
S-PBGA-B896
|
S-PBGA-B896
|
| JESD-609 Code |
e1
|
e1
|
| Length |
31 mm
|
31 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
75264
|
75264
|
| Number of Equivalent Gates |
3000000
|
|
| Number of Inputs |
620
|
620
|
| Number of Logic Cells |
75264
|
75264
|
| Number of Outputs |
620
|
620
|
| Number of Terminals |
896
|
896
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Organization |
75264 CLBS, 3000000 GATES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA896,30X30,40
|
BGA896,30X30,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Packing Method |
TRAY
|
|
| Peak Reflow Temperature (Cel) |
245
|
245
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FPGA SOC
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.44 mm
|
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
31 mm
|
31 mm
|
| Base Number Matches |
1
|
3
|
|
|
|
Compare M1A3PE3000L-1FGG896M with alternatives
Compare M1A3PE3000L-1FGG896Y with alternatives