Findchips: Compare M1A3P600L-1PQG208Y vs M1A3P600L-1FGG144YI

M1A3P600L-1PQG208Y vs M1A3P600L-1FGG144YI feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	MICROSEMI SOC PRODUCTS GROUP	MICROSEMI SOC PRODUCTS GROUP
Package Description	QFP, QFP208,1.2SQ,20	BGA, BGA144,12X12,40
Reach Compliance Code	unknown	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	250 MHz	250 MHz
JESD-30 Code	S-PQFP-G208	S-PBGA-B144
Moisture Sensitivity Level	3	3
Number of Inputs	154	97
Number of Logic Cells	13824	13824
Number of Outputs	154	97
Number of Terminals	208	144
Operating Temperature-Max	70 °C	85 °C
Operating Temperature-Min		-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	QFP	BGA
Package Equivalence Code	QFP208,1.2SQ,20	BGA144,12X12,40
Package Shape	SQUARE	SQUARE
Package Style	FLATPACK	GRID ARRAY
Peak Reflow Temperature (Cel)	245	260
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	COMMERCIAL	INDUSTRIAL
Terminal Form	GULL WING	BALL
Terminal Pitch	0.5 mm	1 mm
Terminal Position	QUAD	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	30
Base Number Matches	3	1
JESD-609 Code		e1
Terminal Finish		Tin/Silver/Copper (Sn/Ag/Cu)
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays