M1A3P600L-1FG144I vs M1A3P600L-1FG144YI feature comparison

M1A3P600L-1FG144I Microsemi Corporation

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M1A3P600L-1FG144YI Microsemi FPGA & SoC

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Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI SOC PRODUCTS GROUP
Package Description LBGA, BGA144,12X12,40 BGA, BGA144,12X12,40
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 350 MHz 250 MHz
JESD-30 Code S-PBGA-B144 S-PBGA-B144
JESD-609 Code e0 e0
Length 13 mm
Moisture Sensitivity Level 3 3
Number of CLBs 13824
Number of Equivalent Gates 600000
Number of Inputs 97 97
Number of Logic Cells 13824 13824
Number of Outputs 97 97
Number of Terminals 144 144
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 13824 CLBS, 600000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA144,12X12,40 BGA144,12X12,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD SILVER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm
Base Number Matches 2 3

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