Findchips: Compare M1A3P600L-1FG144 vs M1A3P600L-1FG144YI

M1A3P600L-1FG144 vs M1A3P600L-1FG144YI feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No
Part Life Cycle Code	Active	Transferred
Ihs Manufacturer	MICROCHIP TECHNOLOGY INC	MICROSEMI SOC PRODUCTS GROUP
Package Description	13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144	BGA, BGA144,12X12,40
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Factory Lead Time	12 Weeks
JESD-30 Code	S-PBGA-B144	S-PBGA-B144
Length	13 mm
Number of Equivalent Gates	600000
Number of Inputs	97	97
Number of Logic Cells	13824	13824
Number of Outputs	97	97
Number of Terminals	144	144
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min		-40 °C
Organization	600000 GATES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	LBGA	BGA
Package Equivalence Code	BGA144,12X12,40	BGA144,12X12,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY, LOW PROFILE	GRID ARRAY
Programmable Logic Type	FPGA SOC	FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max	1.55 mm
Supply Voltage-Max	1.575 V
Supply Voltage-Min	1.14 V
Supply Voltage-Nom	1.2 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Width	13 mm
Base Number Matches	3	3
Clock Frequency-Max		250 MHz
JESD-609 Code		e0
Moisture Sensitivity Level		3
Qualification Status		Not Qualified
Temperature Grade		INDUSTRIAL
Terminal Finish		TIN LEAD
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays