M1A3P600-PQG208 vs M1A3P600-2FGG256Y feature comparison

M1A3P600-PQG208 Actel Corporation

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M1A3P600-2FGG256Y Microsemi FPGA & SoC

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Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ACTEL CORP MICROSEMI SOC PRODUCTS GROUP
Package Description 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 LBGA,
Reach Compliance Code compliant unknown
Clock Frequency-Max 350 MHz
JESD-30 Code S-PQFP-G208 S-PBGA-B256
JESD-609 Code e3 e1
Length 28 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 13824 13824
Number of Equivalent Gates 600000 600000
Number of Inputs 154
Number of Logic Cells 13824
Number of Outputs 154
Number of Terminals 208 256
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min
Organization 13824 CLBS, 600000 GATES 13824 CLBS, 600000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP LBGA
Package Equivalence Code QFP208,1.2SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH GRID ARRAY, LOW PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 4.1 mm 1.7 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1 mm
Terminal Position QUAD BOTTOM
Width 28 mm 17 mm
Base Number Matches 3 3
Part Package Code BGA
Pin Count 256
HTS Code 8542.39.00.01
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30

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