M1A3P600-FGG256II
vs
M1A3P600-FG256
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
BGA,
|
17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
350 MHz
|
350 MHz
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| Length |
17 mm
|
17 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
13824
|
13824
|
| Number of Equivalent Gates |
600000
|
600000
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
13824 CLBS, 600000 GATES
|
13824 CLBS, 600000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
250
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.8 mm
|
1.8 mm
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.425 V
|
1.425 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
17 mm
|
17 mm
|
| Base Number Matches |
1
|
6
|
| Factory Lead Time |
|
12 Weeks
|
| Number of Inputs |
|
177
|
| Number of Outputs |
|
177
|
| Packing Method |
|
TRAY
|
|
|
|
Compare M1A3P600-FGG256II with alternatives
Compare M1A3P600-FG256 with alternatives