Findchips: Compare M1A3P600-FGG144Y vs M1A3P600-FG144Y

M1A3P600-FGG144Y vs M1A3P600-FG144Y feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Transferred	Active
Ihs Manufacturer	MICROSEMI SOC PRODUCTS GROUP	MICROCHIP TECHNOLOGY INC
Part Package Code	BGA
Package Description	LBGA,	13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FPBGA-144
Pin Count	144
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
JESD-30 Code	S-PBGA-B144	S-PBGA-B144
JESD-609 Code	e1	e0
Length	13 mm	13 mm
Moisture Sensitivity Level	3	3
Number of CLBs	13824	13824
Number of Equivalent Gates	600000	600000
Number of Terminals	144	144
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min
Organization	13824 CLBS, 600000 GATES	13824 CLBS, 600000 GATES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	LBGA	LBGA
Package Equivalence Code	BGA144,12X12,40	BGA144,12X12,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)	260
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max	1.55 mm	1.55 mm
Supply Voltage-Max	1.575 V	1.575 V
Supply Voltage-Min	1.425 V	1.425 V
Supply Voltage-Nom	1.5 V	1.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	COMMERCIAL	COMMERCIAL
Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)	TIN LEAD
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30
Width	13 mm	13 mm
Base Number Matches	3	3
Rohs Code		No
Number of Inputs		97
Number of Outputs		97
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays