M1A3P600-FGG144IY
vs
M1A3P600-FGG144YI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Moisture Sensitivity Level
3
3
Peak Reflow Temperature (Cel)
260
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Time@Peak Reflow Temperature-Max (s)
30
30
Base Number Matches
1
1
Package Description
LBGA,
JESD-30 Code
S-PBGA-B144
JESD-609 Code
e1
Length
13 mm
Number of CLBs
13824
Number of Equivalent Gates
600000
Number of Terminals
144
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
13824 CLBS, 600000 GATES
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Equivalence Code
BGA144,12X12,40
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
Seated Height-Max
1.55 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.425 V
Supply Voltage-Nom
1.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
13 mm
Compare M1A3P600-FGG144IY with alternatives
Compare M1A3P600-FGG144YI with alternatives