M1A3P600-FGG144II
vs
M1A3P600-1PQ208IY
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144
QFP-208
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B144
Length
13 mm
Moisture Sensitivity Level
3
Number of CLBs
13824
Number of Equivalent Gates
600000
Number of Inputs
97
Number of Outputs
97
Number of Terminals
144
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
13824 CLBS, 600000 GATES
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Equivalence Code
BGA144,12X12,40
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Seated Height-Max
1.55 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.425 V
Supply Voltage-Nom
1.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
13 mm
Base Number Matches
1
1
Date Of Intro
2016-03-25
kg CO2e/kg
12.2
Average Weight (mg)
2363.75
CO2e (mg)
28837.75
Category CO2 Kg
12.2
Compliance Temperature Grade
Industrial: -40C to +100C
Candidate List Date
2017-07-07
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Status Source
CMRT V5.10
Compare M1A3P600-FGG144II with alternatives
Compare M1A3P600-1PQ208IY with alternatives