M1A3P600-FGG144
vs
M1A3P600-FG144I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144
LBGA,
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
12 Weeks
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B144
S-PBGA-B144
JESD-609 Code
e1
e0
Length
13 mm
13 mm
Moisture Sensitivity Level
3
3
Number of CLBs
13824
13824
Number of Equivalent Gates
600000
600000
Number of Inputs
97
Number of Outputs
97
Number of Terminals
144
144
Operating Temperature-Max
85 °C
100 °C
Operating Temperature-Min
-40 °C
Organization
13824 CLBS, 600000 GATES
13824 CLBS, 600000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA144,12X12,40
BGA144,12X12,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Packing Method
TRAY
Peak Reflow Temperature (Cel)
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.55 mm
1.55 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD SILVER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
13 mm
13 mm
Base Number Matches
6
4
Compare M1A3P600-FGG144 with alternatives
Compare M1A3P600-FG144I with alternatives