M1A3P600-FG256IY
vs
M1A3P600-FGG484YI
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
FPBGA-256
|
23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FPBGA-484
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Date Of Intro |
2016-03-25
|
|
Additional Feature |
TERM PITCH-MIN
|
|
Clock Frequency-Max |
350 MHz
|
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B484
|
Length |
17 mm
|
23 mm
|
Number of Equivalent Gates |
600000
|
600000
|
Number of Terminals |
256
|
484
|
Operating Temperature-Max |
100 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
600000 GATES
|
13824 CLBS, 600000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
1.7 mm
|
2.44 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
17 mm
|
23 mm
|
Base Number Matches |
2
|
3
|
Rohs Code |
|
Yes
|
JESD-609 Code |
|
e1
|
Moisture Sensitivity Level |
|
3
|
Number of CLBs |
|
13824
|
Number of Inputs |
|
235
|
Number of Outputs |
|
235
|
Peak Reflow Temperature (Cel) |
|
250
|
Terminal Finish |
|
TIN SILVER COPPER
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare M1A3P600-FG256IY with alternatives
Compare M1A3P600-FGG484YI with alternatives